JPS6330794B2 - - Google Patents
Info
- Publication number
- JPS6330794B2 JPS6330794B2 JP1601182A JP1601182A JPS6330794B2 JP S6330794 B2 JPS6330794 B2 JP S6330794B2 JP 1601182 A JP1601182 A JP 1601182A JP 1601182 A JP1601182 A JP 1601182A JP S6330794 B2 JPS6330794 B2 JP S6330794B2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- board
- double
- conductor pattern
- sided copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910052782 aluminium Inorganic materials 0.000 claims description 16
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 16
- 229910000679 solder Inorganic materials 0.000 claims description 12
- 239000004020 conductor Substances 0.000 claims description 7
- 238000005530 etching Methods 0.000 claims description 7
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 238000005476 soldering Methods 0.000 claims description 6
- 238000004080 punching Methods 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 239000011889 copper foil Substances 0.000 claims description 3
- 238000000034 method Methods 0.000 description 17
- 239000000758 substrate Substances 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 238000007743 anodising Methods 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 1
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical group [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
- Combinations Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1601182A JPS58132990A (ja) | 1982-02-03 | 1982-02-03 | 印刷配線回路板の製造法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1601182A JPS58132990A (ja) | 1982-02-03 | 1982-02-03 | 印刷配線回路板の製造法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58132990A JPS58132990A (ja) | 1983-08-08 |
| JPS6330794B2 true JPS6330794B2 (en]) | 1988-06-21 |
Family
ID=11904637
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1601182A Granted JPS58132990A (ja) | 1982-02-03 | 1982-02-03 | 印刷配線回路板の製造法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58132990A (en]) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6008204B2 (ja) | 2011-07-29 | 2016-10-19 | パナソニックＩｐマネジメント株式会社 | 素子搭載用基板、ならびに半導体モジュールおよびその製造方法 |
-
1982
- 1982-02-03 JP JP1601182A patent/JPS58132990A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58132990A (ja) | 1983-08-08 |
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